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device performance specification revision 2.0 mtd/ps-0609 february 27, 2006 kodak kai-2001 image sensor 1600(h) x 1200(v) interline ccd image sensor
table of contents summary sp ecification ............................................................................................................................... .................................... 5 device description ............................................................................................................................... ........................................... 6 architecture ............................................................................................................................... .................................................. 6 pixel ............................................................................................................................... .............................................................. 7 vertical to ho riz o ntal tr anf e r ............................................................................................................................... ...................... 8 horizontal re gis t er to float i ng diffu s i on ............................................................................................................................... .... 9 horizontal re gister split ............................................................................................................................... ............................ 10 single output operation ............................................................................................................................... ......................... 10 dual output operation ............................................................................................................................... ............................ 10 output ............................................................................................................................... ......................................................... 11 pin des c ription and physical orientation ............................................................................................................................... .. 12 performa nce ............................................................................................................................... .................................................. 13 power - estimated ............................................................................................................................... ...................................... 13 frame rates ............................................................................................................................... ............................................... 13 im aging perf orm a nce ............................................................................................................................... ................................ 14 imaging perf ormance ope r ational cond itions .................................................................................................................... 14 imaging perf ormance spe c ification s ............................................................................................................................... .... 14 defect definitions ............................................................................................................................... ................................... 16 quantum efficiency ............................................................................................................................... ................................. 17 angular qu antum efficienc y ............................................................................................................................... .................. 18 dark current versus temp erature ............................................................................................................................... ........ 19 test definiti ons ............................................................................................................................... .............................................. 20 test regions of interest ............................................................................................................................... ............................. 20 overcl ocking ............................................................................................................................... .............................................. 20 tests ............................................................................................................................... ............................................................ 21 operation ............................................................................................................................... ........................................................ 24 ma xi mum r a t i ngs ............................................................................................................................... ...................................... 24 maximum voltage rating s between pins ............................................................................................................................... .2 4 dc b i as operating conditio ns ............................................................................................................................... ................... 24 ac oper ating condition s ............................................................................................................................... ............................ 25 clock le vels ............................................................................................................................... ............................................ 25 clock line capacitances ............................................................................................................................... ........................ 25 timing requirements ............................................................................................................................... ................................. 26 timing modes ............................................................................................................................... ............................................. 27 p r ogressi ve s c an ............................................................................................................................... .................................... 27 frame timin g ............................................................................................................................... ............................................. 28 frame timin g without binning ? progre s s ive sc am ........................................................................................................... 28 frame ti min g for vertical binning by 2 ? p r ogres s ive scan ............................................................................................... 28 f r a m e t i m i ng e d g e a l i g nm e n t ............................................................................................................................... .............. 29 line timing ............................................................................................................................... ................................................. 30 line timing single output ? progress ive scan .................................................................................................................... 30 line timing d u al outp u t ? p r ogressi ve s c an ...................................................................................................................... 30 line timing vertical binni n g by 2 ? progr e ssi ve sc an ........................................................................................................ 31 line timing d e tail ? progre s s ive sc an ............................................................................................................................... .. 32 line timing binning by 2 d e tail ? progre s s ive sc an ........................................................................................................... 32 line timing edge align m en t ............................................................................................................................... .................. 33 ?east m an kodak compan y, 2 006 www.kodak.com/go/imager s r e vision 2 . 0 mtd/ps-0 60 9 p 2
pixel timing ............................................................................................................................... ................................................ 34 pixel timing deta il ............................................................................................................................... .................................. 34 fast l i ne du mp t i ming ............................................................................................................................... .............................. 35 electronic sh utter ............................................................................................................................... ...................................... 36 electronic sh utter line timing ............................................................................................................................... .............. 36 electronic sh utter ? integration time de finition ................................................................................................................. 36 electronic sh utter description ............................................................................................................................... .............. 37 large signa l output ............................................................................................................................... ................................... 37 storage and handling ............................................................................................................................... .................................... 38 mechanica l d r awing s ............................................................................................................................... ..................................... 39 pa cka g e ............................................................................................................................... ...................................................... 39 die to p a ckag e align m ent ............................................................................................................................... .......................... 40 glass ............................................................................................................................... ........................................................... 41 glass tra n smiss i on ............................................................................................................................... .................................... 42 qualit y as sur a nce and reli ability ............................................................................................................................... .................. 43 ordering info rmati o n ............................................................................................................................... ..................................... 44 revi sion ch anges ............................................................................................................................... ........................................... 45 ?east m an kodak compan y, 2 006 www.kodak.com/go/imager s r e vision 2 . 0 mtd/ps-0 60 9 p 3
t a ble of fi gure s figure 1: sensor architecture ............................................................................................................................... ......................... 6 figure 2: pixe l architecture ............................................................................................................................... ............................. 7 figure 3: vert ical t o horizontal tr ansfer architecture .................................................................................................................. 8 figure 4: horizontal regist er to floating diffusion arc h itecture ................................................................................................. 9 figure 5: horizontal regist er ............................................................................................................................... ........................ 10 figure 6: output architecture ............................................................................................................................... ........................ 11 figure 7: p o wer ............................................................................................................................... .............................................. 13 figure 8: fr ame rate s ............................................................................................................................... ................................... 13 figure 9: mon o chrome quantum efficien cy ............................................................................................................................... .1 7 figure 10: color qu antum efficiency ............................................................................................................................... ............ 17 figure 11: ult r aviole t qu an tum efficienc y ............................................................................................................................... .... 18 figure 12: an gular quantu m efficiency ............................................................................................................................... ........ 18 figure 13: dark current ve rs us temper ature ............................................................................................................................. 19 figure 14: overclock regions of interest ............................................................................................................................... ...... 20 figure 15: te st sub region s of interest ............................................................................................................................... ........ 23 figure 16: clock line cap a citances ............................................................................................................................... .............. 25 figure 17: fr aming timing without b i nning ............................................................................................................................... .2 8 figure 18: fr ame timing fo r vertical binning by 2 ...................................................................................................................... 28 figure 19: fr ame timing edge align m en t ............................................................................................................................... .... 29 figure 20: line timing single output ............................................................................................................................... ............ 30 figure 21: line timing dual output ............................................................................................................................... .............. 30 figure 22: line timing vertical binning by 2 ............................................................................................................................... 31 figure 23: line timing detail ............................................................................................................................... ........................ 32 figure 24: line timing by 2 detail ............................................................................................................................... ................. 32 figure 25: l i ne tim i ng edg e align m ent ............................................................................................................................... ........ 33 figure 26: pixel timing ............................................................................................................................... .................................. 34 figure 27: pixel timing det a il ............................................................................................................................... ....................... 34 figure 28: fast line du mp timing ............................................................................................................................... ................ 35 figure 29: ele c tronic shutter line timin g ............................................................................................................................... .... 36 figure 30: int e gration time definition ............................................................................................................................... .......... 36 figure 31: package dr awin g ............................................................................................................................... ......................... 39 figure 32: die to p a ckage alignment ............................................................................................................................... ............ 40 figure 33: glass drawing ............................................................................................................................... .............................. 41 figure 34: gla s s tran sm is sion ............................................................................................................................... ...................... 42 ?east m an kodak compan y, 2 006 www.kodak.com/go/imager s r e vision 2 . 0 mtd/ps-0 60 9 p 4
summary specification kodak kai-2001 ima ge sensor 1600 (h) x 1200 (v) interline t ransfer progressive scan ccd description the kodak kai-20 01 image sensor is a h i gh- performance 2-million pixe l sensor designed for a wide range of medical, scientific and machine vision applic ations. the 7.4 m square pixels with microlen ses provide high sensitivity and the large full well cap a city res u lts in high dynamic range. the s p lit horizontal register offers a choice of single or dual output allow i ng either 15 or 30 frame per seco nd (fps ) video ra te for the progressi vely scan n e d im ages. a l s o in clu d ed is a fast line dump for s u b-s a mpling at higher frame rates . the vertical overflow drain str u cture provid es antiblooming protection and enables ele c tronic shuttering for precise exposure control. other features in clude low d a rk current, negli g ible lag and low smear. features ? high resolution ? high sen s itivity ? high dynamic ra nge ? low noise ar chitectur e ? high frame rate ? bi nni ng c a pabi li t y fo r hi ghe r f r ame rate ? e l ectronic shu tte r applications ? i n d u str i al inspection 0. 00 0. 10 0. 20 0. 30 0. 40 0. 50 0. 60 400 500 600 700 800 900 1000 w a v e l e n g th (nm ) a b s o l u t e q u an t u m e f f i ci en cy m onoc hr om e w i t h m i c r ol ens re d g r een bl u e parameter v a l u e architectu re i n te r l in e ccd; pr ogr e ssive scan total nu mber of pixels 16 40 (h) x 12 14 ( v ) = approx. 1.99m n u mber of eff e ctive pixels 16 08 (h) x 12 08 ( v ) = approx. 1.94m number o f active pixels 16 00 (h) x 12 00 ( v ) = approx. 1.92m numbe r o f ou tpu t s 1 or 2 pixel size 7.4 m (h) x 7.4 m (v) image r si ze 14. 80 3mm (di a gonal) ch ip size 13.38mm (h) x 9.52mm (v) aspe c t rati o 4:3 satu rati on si gna l 40, 0 00 e peak quantum eff i cien cy (kai- 4 02 1m) 55% peak quantum eff i cien cy (kai- 4 02 1c m) bg r 4 5 % , 42 %, 35 % ou tput sen s itivity 1 6 v/e total system n o ise (at 40mh z ) 40 e total system n o ise (at 20mh z ) 23 e dark c u rre nt < 0. 5 n a /c m2 dark c u rre nt d o ubli ng temper atur e 7c dynami c ra nge 60 d b c h arge t r ans f e r e f fi c i e n c y > 0. 99 99 9 blooming s u pp ression 300x sme a r 8 0 d b image lag <1 0 e maximum data rate 40 mh z all par a meter s a b ove ar e specif ie d at t = 40 c ?east m an kodak compan y, 2 006 www.kodak.com/go/imager s r e vision 2 . 0 mtd/ps-0 60 9 p 5
device description architecture 4 b uf fe r rows 16 00 (h) x 12 00 (h) activ e pixels 4 bu ffer rows 2 dark rows 4 bu ffer rows 4 buffe r c o lumns 16 dark colu mn s 16 dark colu mn s 4 dummy pix e ls 4 dummy pix e ls 4 buffe r c o lumns dual output or video l video r 4 1 6 4 1600 4 1 6 4 single 41 6 4 8 0 0 8 0 0 4 1 6 4 4 dark rows g g r b pi xel 1,1 figure 1: senso r architectu re there are 2 li ght shielded rows fol l owed 1208 ph oto a ctive rows and fin a lly 4 more light shielded rows. the first 4 and the last 4 photoactive rows are buffer rows givin g a total of 1200 lines of image data. in the single output mode all pixels are clocked out of the video l outpu t in the lower left corner of the sensor. the first 4 empt y pixels of e a ch line do n o t receive charge from the vertical shift register. the next 16 pixels receive charge from t h e left light sh ielded edge followed by 1608 photosensitive pixels and fina ll y 1 6 mo re light shiel d ed pixels from t h e right edge of the sensor. the fir s t and last 4 photosensitive pixels are buffer pixels giving a total of 160 0 pi xels of i m age dat a . in the dual output mode the clocking of the right half of the horizontal ccd is rever s ed. the left half of the image is clocked ou t video l and the right half of the imag e is clocked out v i deo r. e a ch row con s ist s of 4 empty pi xels follo wed by 16 light shie lded pixels followed b y 800 photosensitiv e pixels. wh en reconstructing the image, d a t a f r o m v i d e o r w i l l h a v e t o b e re v e r s e d i n a l i n e b u ff e r and appended to the vide o l dat a . there are 4 dark reference rows at the top and 2 dark rows at the bottom of the image sensor. the dark rows are n o t en tirely dark an d so sh ou ld n o t be u s ed for a dark reference level. use the 16 dark columns on the left or right side of the image sensor as a d a rk reference. of the 16 dar k columns, t h e first and last d a rk colu mns should not be used for det e rmining the zero signal le vel. some light does leak into the first and last dark columns. only use the center 14 columns of the 16 column d a rk reference. ?east m an kodak compan y, 2 006 www.kodak.com/go/imager s r e vision 2 . 0 mtd/ps-0 60 9 p 6
pixel top v i ew di recti o n of ch arge tr an sf er tru e two p h as e burried c h a nnel v c c d lightshield ov e r v c c d n o t shown 7. 4 m v1 phot odi ode 7.4 m v2 tran s f er ga t e di rect ion of ch a r g e tran s f er v1 v2 v1 n- n n- n- p w e ll ( g nd ) c r oss secti on d o wn through v c c d n s u b s trate p v1 n p+ li gh t s h i e l d p p n n substrate p c r os s sec t io n through phot odio d e and vc cd ph a se 1 photo diode p p v2 n p+ light shield p p n n su b s t r a t e p cross sect ion through phot odi ode a n d vc cd phase 2 at transfer gate tr a n sf er ga te cross secti on s howi ng lenslet drawings n o t sc ale lenslet vc cd vc cd light shield light shield photodiod e red col o r f ilter figure 2: pixel a r chitecture an electronic representation of an i m age is for m ed wh en incident phot ons falling on the sensor plane create electron-hole pairs wit h in the in dividual silicon photodiodes. these photoelectrons are collected locally by the formation of potentia l wells at each photosite. below phot odiode sat u ration, the number of photoelectrons collected at each pixel is linearly dependant upon light level and exposure time and n o n- linearly dependant on wavelength. when the photodi o de s charge capacity is re ac hed, excess electrons are discharged into the sub s trate to pr event blooming. ?east m an kodak compan y, 2 006 www.kodak.com/go/imager s r e vision 2 . 0 mtd/ps-0 60 9 p 7
vertical to horizontal tranfer t op v i ew dir e c t ion of vert ic al charg e t r ansfe r v1 v2 v1 phot o diode v2 t r ansfer ga te f ast line du m p h1 s h2 s h 1 b h 2 b dir e c t ion of horizont al charge t r a n sfer lightshield not shown f i gure 3: ve rti c a l to hori zo nta l t r a n s f e r a r c h i t e c t u r e when the v1 and v2 timin g inputs are pulsed, charg e in every pixel of the vccd is shifted one row towards the hccd. the last row next t o the hccd is shifted into the hc cd. when the vccd i s shif ted, the timing signals to th e hccd m u st be stopp e d. h1 mu st be stopped in the high state an d h2 must be stopped in t h e low state. the hccd clocking may begin thd s after the falling edge of the v 1 and v2 pulse. ch arge i s tra n sferred fro m th e la st ve rtical c c d p h ase into the h1s horizontal ccd phase. refe r to figure 23 for an ex ample of ti ming tha t a ccomp lish es the vertical to horizontal tr ans f er of ch arge. if the fast line dump is held at the high level (fdh) during a vertic al to horizontal transfer, then t h e entire line is removed and not transferred into the ho rizontal register. ?east m an kodak compan y, 2 006 www.kodak.com/go/imager s r e vision 2 . 0 mtd/ps-0 60 9 p 8
horizont al register to floating diffusion n+ r o g h 2b h 1 b h 2s h2b h 1s h1b n- n- n- rd floating diffu s i o n n (burried channel) n n+ p (gnd ) n (su b ) h1s n- f i gure 4: ho ri zon t a l re gi s t e r to f l oati ng di f f usi o n arc h i t e c tu re the hccd h a s a total o f 1648 pixel s . the 164 0 ver t ical shift registers (columns) are shifted into the center 1640 pixels of the hccd. there are 4 pixels at both ends of the hccd, which receive no charge from a vertical shift register. the first 4 clock cycles of th e hccd will be empty pixels ( c ontaining no electrons). the next 16 clock cycles will c o ntain only el ectrons ge nerated by dark current in th e vccd and photodiode s. the next 1608 clock cycles will contain phot o-electrons (image data). finally, the last 16 clock cycles will cont ain only electrons generated by dark current in the vccd and photodiodes. of the 16 dar k columns, t h e first and last dark colu mn s should not be used for determining the zero signal level. so me lig h t does leak i n to the first and last dar k colu mns. only us e the center 14 colu mns of the 16 column d a rk reference. when the hccd is shifting valid image data, the timing inputs to the electronic shutter (sub), v ccd (v1, v2), and f a s t l i n e d u m p ( f d ) s h o u l d be not be pulsed. this prevents unwanted noise from being introduced. the hccd is a type of charg e coupled de vice known as a pseudo-two p h ase ccd. th is type of ccd has the ability to shift charg e in two direct ions. this allow s the entire image to be shifted out to the video l output, or to the video r outp ut (left/right image reversal). the hccd is split into two equal halves of 824 pixels each. when operating the sensor in single outp ut mode the two h a l v es of t h e hc c d a r e sh i f t e d i n t h e s a m e d i r e c t io n . when operating the sensor in dual output mode the t w o halve s of the hccd are shifted in opposite directions. the direction of charge tr ansfer in e a ch half is controlled by the h1bl, h2bl, h1b r , and h2 b r timing inp u ts. ?east m an kodak compan y, 2 006 www.kodak.com/go/imager s r e vision 2 . 0 mtd/ps-0 60 9 p 9
horizont al register split si n g l e ou tp ut h2s l h 1 sl h1bl h 2 sr h1 s r h2 b r h1 b r pixe l 82 4 pixe l 82 5 h2 s l h2 b l h1 b l h1 h1 h1 h1 h1 h2 h 2 h2 h2 h 2 h2s l h 1 sl h1bl h 2 sr h1 s r h2 b r h1 b r pixe l 82 4 pixe l 82 5 h2 s l h2 b l h1 b l h1 h1 h1 h1 h1 dua l ou tp ut h2 h2 h 2 h2 h2 f i gure 5: ho ri zon t a l re gi s t e r single output operation when operating the sensor in single output mode all pixels of the i m age sensor will be shifte d out the video l output (pin 31). to conserve power and lower h e at generation the output amplifier for video r may be turned off by connecting v ddr (pin 24) and voutr (pin 24) to gnd (z ero volt s). the h1 timing from the timing diag rams should be applied to h1sl, h1b l , h1sr , h2b r , and the h2 timing should be ap plied to h2sl, h2b l , h2s r , and h1b r . in other words, the clock driver generating the h1 timing should be connected to pins 4, 3, 13, and 15. the cl ock driver generating the h2 timing should be connected to pins 5, 2, 12 , and 14. the horizontal ccd sh ould be clocked for 4 empty p i xels plus 16 light shielded pixels plus 1608 ph otoactive pixe ls pl u s 16 lig h t shielded pi xels f o r a to ta l o f 16 4 4 pi x e ls . dual output operation in dual outpu t mode the connections to the h1br and h2b r pins ar e swap ped from the single output mod e to change the di rection of ch arge transfer of the right side horizontal shift register. in dual output mode both v d d l and vddr (pins 25, 24) should be conn ected to 15 v. the h1 timing from the timing diagrams should be applied to h1s l , h1 bl, h1s r , h1b r , and the h2 timing sh ould be applied t o h2sl, h2bl, h2s r , and h2b r . the c l ock driver generating the h1 timing should be connected to pins 4, 3, 13, and 14. the clock driver generating the h2 timing should be connected to pins 5, 2, 12, and 15. t h e horizontal ccd should be clocked for 4 e m pty pixels plus 16 light shielded pixels plus 80 4 photo a ctive pixel s f o r a total of 824 p i xels. if the came r a i s t o h a v e t h e o p t i o n o f du al or sin g le ou tpu t mode, th e clock driver sign al s se n t to h1br and h2br may be swapped by using a r e lay. another alternative is to h a ve t w o e x tra clock drivers for h1b r and h2br and invert the signals in the timing logic generator. if two extra cloc k drivers are used, care must be taken to ensure the rising and falling edges of the h 1 b r a n d h 2 b r c l o c k s o c c u r a t t h e s a m e t i m e ( w i t h i n 3ns) as the ot her hccd clocks. ?east m an kodak compan y, 2 006 www.kodak.com/go/imager s r e vision 2 . 0 mtd/ps-0 60 9 p 1 0
output f l oating diffusion h ccd cha r ge transfer sourc e follower #1 sou r c e follower #2 sour c e follow e r #3 rd r og h2 b h1 b h2 s h2 b h1 s vd d vo ut h1 s vdd vs s figure 6: outp ut architectu re charge packets contained in the horizo ntal regis t er are dumped pixe l by pixel onto the float i ng diffusion (fd ) output node whos e pote ntial varie s linearly with the quantity of charge in each packet. the amoun t of potential charge is determined by the expression ? vfd= ? q/ cfd. a three-stag e sour ce-foll ower amp l ifie r is used to buffe r this sign al voltage off c h ip with slig htly less th an unity gain. the translation from the charge domain to the volt age domain is qu antified by the output sensitivity or charge to voltage conve r sion in terms of microvolts pe r electron ( v/ e - ). after the sign al h a s b een sampled off c h ip, the reset clock (r) re move s the ch arge from the floating diffusion and resets its potential to the reset drain vo ltage ( r d) . when the image sen s or is operated in the binned or summed interlaced mod e s there will be more than 40,000 electrons in the ou tput signal. the image se nsor is de signed with a 16v/ e charge to voltage conver sion on the output. this means a full signal of 40, 000 electrons will produce a 640 mv chang e on the output amp l ifier. the output amplifier was designed to handle a n o u t p u t s w i n g o f 6 4 0 m v a t a p i x e l r a t e o f 4 0 m h z . i f 80,000 electron charge packets are g e nerated in the binned or summed interlaced modes then the out p ut amp l ifier output will h a ve to sw ing 1 280 mv. the out p ut amp l ifier doe s not have enou gh bandwidth (slew rate) to handle 1280 mv at 40 mh z. hence, the pixel rate will have to be re duced to 20 mhz if the full dynamic range of 80,00 0 electr o ns is desired . the charge handling c a pacity of the ou tput ampl ifier is al so set by th e reset clock vo ltage le vels. the reset clock driver circuit is very si mple if an amplitud e of 5 v i s u s ed. but the 5 v amplitude restricts the output amplifier charge capac i ty to 40,000 electrons. if the full dynamic range of 80,000 electrons is desired then the reset cl ock amp l itude will have to be in creased to 7 v. if you only want a maximu m sign al of 4 0 ,000 electro ns in binned or su mmed interlaced modes, then a 40 mhz pixel rate wit h a 5 v reset clock may be used. the output of the ampl i f ier will be unpredictable abo v e 4 0 , 000 electron s so be su re to se t the maxi mum input s i gnal level of your anal og to digi ta l converter to the equivalent of 40,0 00 elec trons (64 0 mv ). ?east m an kodak compan y, 2 006 www.kodak.com/go/imager s r e vision 2 . 0 mtd/ps-0 60 9 p 1 1
pin description and physical orientation vss vout l esd v2 v1 vsub gnd vddl vddr gnd vsub v1 v2 gnd vout r vss rr rl h2 bl h1 bl h1s l h2s l og l og r rd r rdl h2 sr h1 sr h1 br h2 br gn d fd pixel 1,1 17 32 1 31 30 29 28 27 26 25 2 4 23 2 2 21 20 19 18 23 4 5 6 7 8 9 1 5 14 13 12 11 10 1 6 pin n a m e descrip t i o n pin n a m e descrip t i o n 1 r l reset gate, left 32 v s s o u t p u t a m p l i f i e r retu r n 2 h 2 b l h 2 ba rri e r , le f t 3 1 voutl video output , left 3 h 1 b l h 1 b a r r i er , lef t 3 0 e s d e s d 4 h1sl h 1 s t or a g e, l e ft 2 9 v2 ver t ical clock, p h ase 2 5 h2sl h 2 s t or a g e, l e ft 2 8 v1 ver t ical clock, p h ase 1 6 g n d g r ou n d 2 7 vsu b subst r ate 7 ogl ou tput gate, left 2 6 gn d gr oun d 8 rdl re s e t dra i n , le ft 2 5 v d d l v d d , le f t 9 rd r re s e t dra i n , ri g h t 24 vdd r vdd, ri gh t 10 ogr outpu t gate, rig h t 23 gnd grou nd 11 f d f a st li ne dump g a te 22 vsu b subst r ate 12 h2sr h 2 s t or a g e, r i g h t 2 1 v1 ver t ical clock, p h ase 1 13 h1sr h 1 s t or a g e, r i g h t 2 0 v2 ver t ical clock, p h ase 2 14 h1br h 1 ba r r i er , r i g h t 1 9 gn d gr oun d 15 h 2 b r h2 ba rri e r , ri gh t 18 vou t r vi de o output , ri g h t 16 r r reset gate, right 17 v s s o u t p u t a m p l i f i e r retu r n the pins are on a 0. 070? spacing ?east m an kodak compan y, 2 006 www.kodak.com/go/imager s r e vision 2 . 0 mtd/ps-0 60 9 p 1 2
pe rfo rmance power - estimated 0 50 100 150 200 250 300 350 400 450 500 0 5 10 15 2 0 25 30 35 40 h o r i z o n t a l c l o c k f r eq u e n c y ( m h z ) po we r ( m w) o u tput p o w e r o ne o u t p u t ( m w ) h o r i z ontal p o w e r ( m w ) v e rt i c a l p o w e r o n e o u t p u t (m w ) t o tal p o w e r o ne o u tput ( m w ) r i gh t o u t p u t d i s a bl e d figure 7: power frame rates 0 10 20 30 40 50 60 70 10 1 5 20 2 5 30 35 40 p i xe l cl o c k (m h z ) frame rate (fps) s i ng le ou tpu t du al out put or s i n g l e 2x 2 bi nni ng d ual 2 x 2 bi nn ing figu r e 8 : fr ame r a tes ?east m an kodak compan y, 2 006 www.kodak.com/go/imager s r e vision 2 . 0 mtd/ps-0 60 9 p 1 3
imaging performance imaging p e rformanc e op era t ional cond itions unless other w ise noted, th e imaging performance sp ecifi cation s are measured using the following conditions. descrip t i o n c o n d i t i o n n o t e s f r ame t i me 23 7 mse c 1 horizontal clock frequency 10 mh z light so urce c o nti n uous re d, gre e n and bl ue i l l u mi nati on c e nte r e d at 4 50, 53 0 and 6 5 0 nm 2,3 oper ation n o min a l oper a t ing voltages an d ti min g note s: 1. e l ectronic shu tte r is not used. in tegration time equ a ls frame time. 2. le ds use d : bl ue : ni c h i a nlpb 500, green: nichia nspg50 0s and re d: hp hlmp- 8 11 5. 3. f o r monoc h rome se nsor, o n ly g r e e n le d use d . imaging p e rformanc e specifications all versio ns d e script i o n s y m b o l mi n . n o m . m a x . u n i t s samp- ling plan temp e ra- tu re test e d at ( c) not e s t e s t dark c e nte r u n i f ormi ty n/a n/a 20 e - r m s d i e 2 7 , 4 0 1 dark g l obal u n i f ormi ty n/a n/a 5.0 mvpp di e 27, 4 0 2 g l obal u n i f ormi t y n/a 2.5 5.0 %rms di e 27, 4 0 1 3 g l obal pe ak to p e ak u n i f ormi ty prnu n/a 10 20 %pp di e 27, 4 0 1 4 c e nte r u n i f o r mi t y n/a 1.0 2.0 %rms di e 27, 4 0 1 5 maxi mum pho t or e s ponse nonli n e a ri ty nl n/a 2 % de si gn 2,3 maximum gain difference betwee n outputs ? g n / a 1 0 % de si g n 2 , 3 max. signal error due to no nlinearity dif. ? n l n / a 1 % de si g n 2 , 3 hor izontal ccd c h ar ge capacity hne n/a 100 n/a ke - d e s i g n ver t ical ccd ch a r ge capacity vne n / a 5 0 n / a ke - d i e photodiode cha r ge capacity pne 38 40 n/a ke - d i e horizontal ccd c h arge trans f er ef f i cien cy hc t e 0 . 9 9 9 9 9 n / a n / a de si g n ver t ical ccd ch a r ge tr an sf e r ef f i cien cy v c t e 0.9 9 9 9 9 n / a n / a de si g n photodi o de da rk c u rre nt ipd n/a 40 35 0 e / p/s di e photodi o de da rk c u rre nt ipd n/a 0.0 1 0.1 na/c m 2 d i e ve rti c al c c d dar k c u r r e n t ivd n/a 40 0 17 11 e / p/s di e ve rti c al c c d dar k c u r r e n t ivd n/a 0.1 2 0.5 na/c m 2 d i e image lag lag n/a <1 0 50 e - d e s i g n anti bloomi n g f a c t or xab 10 0 30 0 n/a de si gn ve rti c a l sme a r smr n/a 80 75 db de s i gn total noise n e- t 2 3 e - r m s d e s i g n 5 total noise n e- t 4 0 e - r m s d e s i g n 6 dynami c ra nge dr 60 db de si gn 6,7 ou tput amplif ier dc of f s et v odc 4 8 . 5 1 4 v di e ou tput amplif ier ban d width f -3 d b 1 4 0 m h z de si g n output amplifier impedance r out 10 0 1 3 0 20 0 o h m s di e ou tput amplif ier sen s itivity ? v/ ? n 1 6 v/e - d e s i g n ?east m an kodak compan y, 2 006 www.kodak.com/go/imager s r e vision 2 . 0 mtd/ps-0 60 9 p 1 4
monoc h rome ve r s i o ns only d e script i o n s y m b o l mi n . n o m . m a x . u n i t s samp- ling plan temp e ra- tu re test e d at ( c) no te s t e s t peak quantum eff i cien c y q e ma x 4 5 5 5 n / a % de si g n peak quantum eff i cien cy wavelengt h qe n / a 5 0 0 n / a n m de si g n c o lor ve rs i o ns on ly d e script i o n s y m b o l mi n . n o m . m a x . u n i t s samp- ling plan temp e ra- tu re test e d at ( c) no te s t e s t peak blue quant u m green efficiency red qe ma x 45 42 35 n / a % de si g n peak blue quant u m green efficiency red wavelengt h qe n/a 47 0 54 0 62 0 n / a n m de si g n n/a: not applicable note s: 1. pe r c o lor. 2 . valu e is over th e r a n g e of 1 0 % to 90 % of ph otodiode satu r a tion . 3 . valu e is f o r th e s e n s or oper ated w i th out bin n i n g 4 . i n clu d es system electr on ics n o ise, dar k patt e r n noi s e and dark c u r r e nt shot noi s e at 20 mh z. 5 . i n clu d es system electr on ics n o ise, dar k patt e r n noi s e and dark c u r r e nt shot noi s e at 40 mh z. 6. u s e s 20log (pne / n e- t ) ?east m an kodak compan y, 2 006 www.kodak.com/go/imager s r e vision 2 . 0 mtd/ps-0 60 9 p 1 5
de fe ct de fin i tio n s d e s c r i p t i o n d e f i n i t i o n m a x i m u m temperature(s) te ste d at ( c ) n o te s t e s t ma j o r da rk field defective pixel de fe c t >= 1 79 mv 1 6 major br igh t field defective pixel de fe c t >= 1 5 % 2 0 2 7 , 4 0 1 7 minor dark field defective pixel de fe c t >= 5 7 mv 20 0 27, 4 0 6 clu s ter def e ct a group of 2 to 10 c o nti g uo us maj o r defective pixels, but no more than 2 adj a c e nt de fe c t s hori zo ntall y 8 2 7 , 4 0 1 colu mn defect a group of mo re than 10 c o nti g uo us major defective pixels along a sing le colu mn 0 2 7 , 4 0 1 note s: 1. ther e will be at least two no n-defective pixels sep a rating an y two major def e ctive pixels. def ect map the defect map supplied with each sensor is based upon testing at an ambient (27 c) temperature. minor point defects are not included in the defect map. all de fective pixe ls ar e reference to pixel 1,1 in the defect maps. ?east m an kodak compan y, 2 006 www.kodak.com/go/imager s r e vision 2 . 0 mtd/ps-0 60 9 p 1 6
quantum efficiency monoch rome quantum efficiency with microlens 0. 0 0. 1 0. 2 0. 3 0. 4 0. 5 0. 6 400 500 600 700 800 900 1000 w a v e l e ng th (nm ) ab s o l u te qu a n t u m e f f i ci en cy m eas u r ed w i t h gl a s s figu r e 9 : monochr o me qu an tu m e f f i cien cy color quantum efficie n cy with microlens 0. 00 0. 05 0. 10 0. 15 0. 20 0. 25 0. 30 0. 35 0. 40 0. 45 0. 50 400 500 600 700 800 900 1000 wa v e l e n g t h ( n m ) absolute quantum efficienc y re d g r een blu e m eas u r ed w i t h gl a s s f i gure 10: c o l o r q u a n t u m e f fi c i e n c y ?east m an kodak compan y, 2 006 www.kodak.com/go/imager s r e vision 2 . 0 mtd/ps-0 60 9 p 1 7
ultrav iole t (uv) quantum effici ency without microlens 0. 00 0. 02 0. 04 0. 06 0. 08 0. 10 0. 12 240 340 440 540 640 7 4 0 840 940 w a v e l e n g th (nm ) absolute quantum efficienc y figure 11: u l travi o let quant u m e f f i ciency angular quan tum efficienc y for the curves marked ?horizontal?, the incident light angle is varie d in a plane p a rallel to the hccd. for the curves marked ?vertical?, the in cident light angle is varied in a plane par a llel to the vccd. monochrome with microlens 0 10 20 30 40 50 60 70 80 90 100 0 5 10 15 20 25 30 a n g l e ( d eg rees ) re l a t i v e qu a n t u m e f f i ci en cy (% ) ho r i z o n t a l v e r t i cal f i gure 12: a n g u l a r q u a n t u m e f fi c i e n c y ?east m an kodak compan y, 2 006 www.kodak.com/go/imager s r e vision 2 . 0 mtd/ps-0 60 9 p 1 8
dark current versus temp erature 1 10 10 0 10 00 100 00 1 000 00 2. 7 2 . 8 2. 9 3 . 0 3. 1 3 . 2 3 . 3 3 . 4 10 00/ t ( k ) ele c t rons /s e c ond t ( c ) 97 84 7 2 60 50 4 0 30 21 v ccd p hot odi o d e s f i gure 13: da rk c u rre nt ve rs us t e mpe r a t ure ?east m an kodak compan y, 2 006 www.kodak.com/go/imager s r e vision 2 . 0 mtd/ps-0 60 9 p 1 9
test definitions test regi ons of interest active area r o i: pixel 1, 1 to pixel 16 00, 1200 center 100 by 10 0 roi : pixel 7 50,5 50 to pixel 84 9,6 49 only the active pixels are u s ed for perfor mance and d e fect tests. overclocking the test syste m timing is c o nfigured suc h that the sen s or is overclocked in both t h e vertical an d horizontal d i rections. see figure 14 for a pictorial representation of the regions. pi xel 1, 1 vert ical overcl ock h o ri zo nt al overc l o c k f i gure 14: ove r c l oc k regions of interest ?east m an kodak compan y, 2 006 www.kodak.com/go/imager s r e vision 2 . 0 mtd/ps-0 60 9 p 2 0
tests 1. dark field center non - uniformit y this test is p e rform ed un d e r dark field con d ition s . only t he cente r 100 by 100 pixels of the sensor a r e u s ed for thi s test - pixel (7 50,550 ) to pixel (849,6 4 9 ) . ? ? ? ? ? ? ? ? = used time n integratio actual time n integratio dps * electrons in pixels 100 by 100 center of deviation standard uniformity center field dark unit s: mv rm s dps integrati on time: device perfo r ma n c e spe c ificati on integratio n time = 33 m s e c 2. dark field g l obal non-uniformit y this te st is p e rform ed un d e r da rk field condition s. th e se n s o r is p a rtitioned into 192 su b regi ons of interest, each of whi c h is 1 00 by 100 pixels in size. see figure 1 5 : test s ub regio n s of interest. the avera ge si gnal level of each of the 192 sub region s of inte rest i s cal c ula t ed. the sign al leve l of each of the sub region s of inte rest i s cal c ula t ed usin g the followin g formul a: signal of roi [ i] = (roi average in a du ? hori zo ntal overcl ock ave r age in a d u) * mv per co u n t whe r e i = 1 t o 192. du ring this cal c ulati on on the 19 2 sub re gion s of interest, th e maximum a nd minimum sign al levels are fou nd. the da rk field global unifo rmity is then calcul ated a s the maximum sign al found minus the mi nimum si gnal level found. units: mvpp (millivolts peak to peak) 3. global non - uniformity this te st is p e rform ed with the imager ill uminated to a level such that the output is at 80% of saturation (ap p roximately 32,000 el ectrons). prior to this test bein g perfo rmed t he su bs trate voltage ha s b een set su ch that the cha r g e cap a city of the sen s or is 40,00 0 ele c tron s. glo b a l uniformity is defined a s ? ? ? ? ? ? ? ? = signal area active deviation standard area active * 100 y uniformit global units: % r m s active area signal = active area averag e ? hori zo nta l overclo c k average ?east m an kodak compan y, 2 006 www.kodak.com/go/imager s r e vision 2 . 0 mtd/ps-0 60 9 p 2 1
4. global peak to peak non-uniformity this te st is p e rform ed with the imager ill uminated to a level such that the output is at 80% of saturation (ap p roximately 32,000 el ectrons). prior to this test bein g perfo rmed t he su bs trate voltage ha s b een set su ch that the cha r g e cap a city of the sen s or is 40,00 0 ele c tron s. the sensor is p a rtit ioned into 1 9 2 sub regio n s of interest, e a ch of which is 100 by 100 pixel s in size. see fig u re 15: te st sub regi on s of interest. the avera ge si gnal level of each of the 192 su b regio n s of int e re st (r oi) is ca lculated. t he sig nal leve l of each of the sub regio n s of interest is cal c ulate d usi ng the following formula: signal of roi[i] = (roi average in adu ? hor i zont al overclock average in adu) * mv per count w here i = 1 to 192. dur i ng th i s calcul ation o n the 19 2 sub r egi ons of inter e st, the maxim u m and mi nim u m sign al lev e l s are found . t he global pea k to peak un ifo rmit y is then c a lculat ed as: signal area active signal minimum - signal maximum uniformity global = units: %pp 5. cen t er non-uniformity this te st is p e rform ed with the imager ill uminated to a level such that the output is at 80% of saturation (ap p roximately 32,000 el ectrons). prior to this test bein g perfo rmed t he su bs trate voltage ha s b een set su ch that the cha r g e cap a city of the sen s or is 40,00 0 ele c tron s. defects are ex clud ed for t he calculatio n of this test. th is te st is pe rform e d on the cente r 100 by 100 pixels (s ee figu re 15: test sub re gion s of interest) of the se nso r . cente r uniformity is defined a s : ? ? ? ? ? ? ? ? = signal roi center deviation standard roi center * 100 uniformity roi center units: % r m s cente r roi s i gnal = cente r roi avera g e ? hori zo nta l overclo c k average 6. dark field de fec t tes t this test is p e rform ed un d e r da rk field con d ition s . the se n s o r is partitione d into 192 su b re gion s of interest, each of whi c h is 1 00 by 100 pixels in size. see figure 15: te st sub regi o n s of intere st. in each re gio n of interest, the media n value of all pi xels is fou nd. for ea ch reg i on of intere st , a pi xel is m a rked d e fecti v e if it is grea ter than o r eq ual to the median valu e of that region of interest pl us the defe c t threshold spe c ified in ?defe c t definition s? sectio n. ?east m an kodak compan y, 2 006 www.kodak.com/go/imager s r e vision 2 . 0 mtd/ps-0 60 9 p 2 2
7. bright field defe ct test this te st is p e rform ed with the imager ill uminated to a level such that the output is at 80% of saturation (ap p roximately 32,000 el ectrons). prior to this test bein g perfo rmed t he su bs trate voltage ha s b een set su ch that the cha r g e cap a city of the sen s or is 40,00 0 ele c tron s. the a v erage sign al level of all active pixels is found. the b r i ght and da rk t h re shol ds are set as: dark defe c t thre shol d = active area signal * thre shol d bright defe c t threshold = active area signal * thre shol d the se nsor i s then partition ed into 192 sub regi on s of intere s t, each of which i s 1 00 by 100 pix e ls in si ze. see figu re 15: test sub regi on s of interest. in ea ch regio n of intere s t, the average valu e of all pixels is fo und. for e a ch regio n of interes t, a pixel is mark ed defec tive if it is gre a ter tha n or equ al to the media n value of that reg i on of intere st plus the bright thresho l d spe c ified o r if it is less th an or eq ual to the median value of that re gi on of intere st minu s the dark threshold spe c ified. example for major b r ight field defe c tive pixels: ? average valu e of all active pixels is fou n d to be 416 m v (32,000 el e c tron s). ? dark defe c t thre shol d: 416mv * 15% = 62.4 mv ? bright defe c t threshold: 416mv * 15% = 62.4 mv ? regi on of intere st #1 sel e cted. thi s reg i on of intere st is pixels 1,1 to pixels 10 0,100. o median of thi s regi on of intere st is found to be 416 m v . o any pixel in this re gion of i n tere st that is >= (416 +62. 4 mv) 478.4 mv in intensit y will be marked defective. o any pixel in this re gion of i n tere st that is <= (416 -62.4 mv) 353.6 m v in intensity will be ma rke d defective. all remainin g 191 sub re gio n s of intere st are an alyze d for defe c tive pixels in the same man ner. t e st sub regions of int e rest pixel (1 ,1 ) pi xe l ( 160 0, 12 00) 1 2 3 4 5 6 7 8 9 10 17 18 19 20 21 22 23 24 25 26 33 34 35 36 37 38 39 40 41 42 49 50 51 52 53 54 55 56 57 58 65 66 67 68 69 70 71 72 73 74 81 82 83 84 85 86 87 88 89 90 97 98 99 10 0 101 102 10 3 104 105 106 113 11 4 11 5 11 6 117 118 11 9 120 121 122 129 13 0 13 1 13 2 133 134 13 5 136 137 138 11 12 13 14 15 16 27 28 29 30 31 32 43 44 45 46 47 48 59 60 61 62 63 64 75 76 77 78 79 80 91 92 93 94 95 96 107 108 109 110 111 112 123 124 125 126 127 128 139 140 141 142 143 144 145 14 6 14 7 14 8 149 150 15 1 152 153 154 155 156 157 158 159 160 161 16 2 16 3 16 4 165 166 16 7 168 169 170 171 172 173 174 175 176 177 17 8 17 9 18 0 181 182 18 3 184 185 186 187 188 189 190 191 192 figure 15: test s u b regions o f interest ?east m an kodak compan y, 2 006 www.kodak.com/go/imager s r e vision 2 . 0 mtd/ps-0 60 9 p 2 3
operat ion maximum ratings absolute maximum r a ting is defined as a level or con d ition that sh ould not be exceeded at an y time per th e description. if the level or the condition is exceeded, the device will be degraded an d may be d a maged. d e s c r i p t i o n s y m b o l min i m u m m a x i m u m u n i t s n o t e s oper atin g temper atur e t -5 0 7 0 c 1 humi di t y r h 5 9 0 % 2 outpu t bi as c u r r e nt iou t 0.0 10 ma 3 o ff- c h i p loa d c l 1 0 pf 4 note s: 1 . n o ise per f or ma nce will degr ade a t h i gh er temper a t u r es. 2. t =25 oc . e x c e ssi ve humi d i t y wi ll de grade mt t f . 3. t o ta l fo r bot h ou t p uts . c u rre nt i s 5 ma fo r e a c h out p ut. note t h a t t h e c u rre n t bi a s a f f e c t s the a m pli f i e r ba ndw i dth . 4. with to tal ou tpu t load capacitance of cl = 10pf between the outp uts and ac gro und. maximum voltage ratings between pins d e s c r i p t i o n min i m u m m a x i m u m u n i t s n o t e s rl, rr , h 1 s, h 2 s, h1 bl, h2 bl, h1b r , h2br, ogr, ogl to esd 0 1 7 v pin to pin wit h esd pro t e c ti o n - 1 7 1 7 v 1 vddl , vd dr to gnd 0 25 v note s: 1. pi ns wi th e s d p r ote c ti on are : rl , rr , h1 s, h 2 s, h1 bl, h 2 b l , h 1 b r , h2b r , og l , and og r. dc bias operating conditio ns d e s c r i p t i o n s y m b o l min i m u m n o m i n a l m a x i m u m u n i t s maximum dc cur r e n t (ma) notes ou tput gate og -3 .0 -2 .5 -2 .0 v 1 a re se t drai n rd 11. 5 12. 0 12. 5 v 1 a outpu t ampli f i e r supply vdd 14. 5 15. 0 15. 5 v 1 ma 1 g r ou n d g n d 0 . 0 0 . 0 0 . 0 v subst r ate s u b 8 . 0 v a b 17. 0 v 2 esd pr otectio n esd -8 .0 -7 .0 -6 .0 v 3 outpu t ampli f i e r re tu rn vss 0.0 0.7 1.0 v note s: 1 . th e oper atin g valu e of th e su bstr ate voltage, vab , will be mar k ed on th e sh ippin g contain e r f o r each de vice. th e valu e vab i s set such that the photodiode charg e capaci ty i s 40,0 00 e l e c tro n s. 2. vesd must be at least 1 volt mor e nega tive than h1 l, h2 l and rl du ring sensors ope r a t i o n a n d d u ri n g c a me ra pow e r tur n o n . 3. one outp ut, un lo ade d ?east m an kodak compan y, 2 006 www.kodak.com/go/imager s r e vision 2 . 0 mtd/ps-0 60 9 p 2 4
ac operating conditions clo c k levels d e s c r i p t i o n s y m b o l min i m u m n o m i n a l m a x i m u m u n i t s n o t e s ve rti c al c c d c l o c k hi gh v2h 7.5 8.0 8.5 v ve rti c al c c d c l o c ks mi dle v e l v1m, v 2 m - 0 .2 0.0 0.2 v ver t ical ccd clo c ks low v1 l, v2 l -9 .5 -9 .0 -8 .5 v hori z on tal c c d c l oc ks ampli t ude h1h, h 2 h 4.5 5.0 5.5 v hor izontal ccd c l ocks low h1 l, h2 l -5 .0 -4 .0 -3 .8 v re se t c l oc k amp l i t ude rh 5.0 v 1 r e set clock low r l -4 .0 -3 .5 -3 .0 v 2 e l e c troni c sh utte r voltage vshut te r 44 48 52 v f a st dump hi gh f d h 4.8 5.0 5.2 v fast du mp low fdl -9 .5 -9 -8 v note s: 1. r e set amplitude must be set to 7. 0 v fo r 8 0 , 0 0 0 e l e c trons o u tp ut i n summe d i n te rlac e d or bi nni ng mo de s. 2. re se t low le ve l must be se t to ? 5 . 0 v f o r 80 ,0 00 e l e c trons ou tpu t in summed interla c ed or binning m o des. clock line capacitances v1 v2 gnd 25nf 25nf h1sl+h1bl 66pf h2sl+h2bl 58pf h1sr+h1br 66pf h2sr+h2br 58pf 20pf 20pf gnd gn d reset 10pf gn d su b 2nf gnd fd 21pf 5nf figu r e 1 6 : clock lin e capacitan c e s ?east m an kodak compan y, 2 006 www.kodak.com/go/imager s r e vision 2 . 0 mtd/ps-0 60 9 p 2 5
timing re quirements d e s c r i p t i o n s y m b o l min i m u m n o m i n a l m a x i m u m u n i t s n o t e s hccd delay t hd 1 . 3 1 . 5 10. 0 s vccd tr an sf e r ti me t vc cd 1 . 3 1 . 5 20. 0 s photodiode tra n sfer time t v3 rd 8 . 0 1 2 . 0 15. 0 s vccd pedestal time t 3p 20. 0 2 5 . 0 50. 0 s vccd delay t 3d 15. 0 2 0 . 0 10 0 . 0 s reset pulse time t r 5 . 0 1 0 . 0 n s shu tter p u lse ti me t s 3 . 0 5 . 0 10. 0 s shu tter p u lse del a y t sd 1 . 0 1 . 6 10. 0 s hccd clock per i od t h 25. 0 5 0 . 0 20 0 . 0 n s vccd r i se/f all ti me t vr 0 . 0 0 . 1 1 . 0 s fast dump gate delay t fd 0 . 0 0 . 0 0 . 5 s ver t ical clock edge align m en t t ve 0 . 0 10 0 . 0 n s note s: ?east m an kodak compan y, 2 006 www.kodak.com/go/imager s r e vision 2 . 0 mtd/ps-0 60 9 p 2 6
timing modes progressive scan p h o t odi o d e c c d s h i f t r egi s t er 0 1 2 3 5 4 7 6 ou t p ut hccd in pro g ressive sca n read out eve r y p i xel in the i m age se ns or is rea d out simulta neo u s ly. each ch arge pa cket is transfe rred f r om the photo d iode to the n e ighb orin g ve rtical cc d shi ft regi ster sim u ltaneo usly. the m a ximu m u s eful sign al output is limited by the pho todiode ch a r g e cap a city to 40,000 el ectrons. ve r t i c al fr a m e ti mi n g lin e t i mi ng repe at for 121 4 li nes ?east m an kodak compan y, 2 006 www.kodak.com/go/imager s r e vision 2 . 0 mtd/ps-0 60 9 p 2 7
frame timing frame timin g wit h out bin n ing ? progre ssive sca m v1 v2 h1 h2 t l t v3 r d t 3p t 3d t l line 1214 lin e 1 line 1213 figure 17: f r aming ti ming withou t bin n ing frame timin g f o r vert ical bi nning by 2 ? progressive scan v1 v2 h1 h2 t l t v3r d t 3p t 3d t l line 607 li ne 1 line 606 3 x t vc cd f i gure 18: f r ame ti mi ng for ve r t i c al bi nni ng b y 2 ?east m an kodak compan y, 2 006 www.kodak.com/go/imager s r e vision 2 . 0 mtd/ps-0 60 9 p 2 8
frame timin g edge align m ent v1 v2 t ve v1 m v1 l v2 h v2 m v2 l figure 19: f r ame timing edge alig nment ?east m an kodak compan y, 2 006 www.kodak.com/go/imager s r e vision 2 . 0 mtd/ps-0 60 9 p 2 9
line timing line timing s i ngle output ? progressive scan v1 v2 t vcc d t l t hd h1 h2 r 2 1 pixel count 19 4 5 6 7 20 21 22 23 16 25 16 26 16 27 16 29 16 30 16 43 16 44 24 16 28 16 42 3 f i gure 20: li ne ti mi ng si ngle outp ut line timing d ual output ? progressive scan v1 v2 t vcc d t l t hd h1 h2 r 2 1 pixel count 19 4 5 6 7 20 21 22 23 81 6 81 7 81 8 82 0 82 1 82 4 82 5 24 81 9 82 3 82 2 3 figure 21: li ne timing dual o u tp ut ?east m an kodak compan y, 2 006 www.kodak.com/go/imager s r e vision 2 . 0 mtd/ps-0 60 9 p 3 0
line timing v e rtical binnin g by 2 ? progr e ssive scan v1 v2 3 x t v ccd t l t hd h1 h2 r 2 1 pixel count 19 4 5 6 7 20 21 22 23 16 25 16 26 16 27 16 29 16 30 16 43 16 44 24 16 28 16 42 3 f i gure 22: li ne ti mi ng ver t ical binn in g by 2 ?east m an kodak compan y, 2 006 www.kodak.com/go/imager s r e vision 2 . 0 mtd/ps-0 60 9 p 3 1
line timing d e tail ? progressive sca n v1 v2 t vccd h2 t hd 1/2 t h r h1 f i gure 23: li ne ti mi ng de tai l line timing binning by 2 d e tail ? progressive sca n v1 v2 t vccd h2 t hd 1/2 t h r h1 t vccd t vccd figure 24: li ne timing by 2 de tail ?east m an kodak compan y, 2 006 www.kodak.com/go/imager s r e vision 2 . 0 mtd/ps-0 60 9 p 3 2
line timing e d ge a l ignm en t applies to all modes. v1 v2 t ve t ve t vccd f i gure 25: li ne ti mi ng e dge ali g nme n t ?east m an kodak compan y, 2 006 www.kodak.com/go/imager s r e vision 2 . 0 mtd/ps-0 60 9 p 3 3
pixel timing h2 r vou t v1 v2 pixe l count du mmy pixe ls l i gh t sh ield e d pixels ph oto s e n sit i ve pixels h1 15 19 2 0 21 4 3 2 figure 26: pixel t i ming pixel timing detail r h2 vo u t t r rh rl h1h h1l h2h h2l h1 figure 27: pixel t i ming detail ?east m an kodak compan y, 2 006 www.kodak.com/go/imager s r e vision 2 . 0 mtd/ps-0 60 9 p 3 4
fast line dump timing t vccd v1 v2 t fd fd t fd t vccd h1 h2 figure 28: fast li ne dump timing ?east m an kodak compan y, 2 006 www.kodak.com/go/imager s r e vision 2 . 0 mtd/ps-0 60 9 p 3 5
electronic shutter elect r onic sh utt e r line ti ming v1 v2 t vccd t s t hd h1 h2 r t sd v s hutte r vsu b f i gure 29: e l e c t r oni c shu tte r li ne t i mi ng electronic sh utter ? integr ation time definition v2 inte grati o n ti me v s hutte r vsu b figure 30: integrat i o n ti me de fi ni ti on ?east m an kodak compan y, 2 006 www.kodak.com/go/imager s r e vision 2 . 0 mtd/ps-0 60 9 p 3 6
elect r onic sh utt e r d e scrip tion the voltage on the substrate (sub) determines the charge capac i ty of the photodiodes. when sub is 8 volts the photodiodes will be at their ma xim u m charge capacity. incr easing vsub above 8 volt s decreases the charge capac i ty of the ph otodiode s until 48 volt s when the photodiod e s have a ch arge capacit y of zero electrons. therefore, a short pulse on sub, with a pe ak amplit ude greater than 48 volt s, empties all p h otodiodes and provides the electronic sh uttering action. it may appe ar the optimal sub s trate voltage setting is 8 volts t o obt a in the maximu m char ge capacity and dynamic range. while setting vsub to 8 volts wi ll prov ide the maximu m dyn a mic r a nge, it will also provide the mini mum ant i bloo ming pro t ection. the kai- 200 1 vccd has a ch arge capacit y of 55,000 electrons (55 ke - ). if the sub voltage is set such that t h e photodiode holds more than 55 ke - , then when the charge is tr an sferred fro m a full photodi o de to v ccd, the vccd will ov erflow. thi s overflo w con d ition manife sts itself in the image by ma king bright s p ots appear elongated in t h e vertical dir ection. the size increase of a bright spot is called blooming w h e n t h e s p o t d o u b l e s i n size. the blooming c a n b e elimin ated by increasing the voltage on sub to lower the charge capacity of the photodiode. t h is ensure s the vccd charge cap a city is greater than the photodiode capacity. there are cases where an ext r emely bright spot will still cause blooming in the vccd. normally, wh en the photodiode is full, any addition al electrons generated by photons will spill out of the photodiode. the excess electron s are drain e d harmle ssly out to the su bs trate. ther e is a maximum rate at whic h the electrons c a n be drained t o the substr ate. if that maximu m r a te is exceeded, (for example, by a very bright light source) then it is p o ssible for the total amount of charge in th e photodiode to exceed the v ccd c a p a city. this result s in blooming. the amount of antibloo ming prot ection also decreases wh en the integration time is decr eased. there is a compromise between photodiode dyn a mic r a nge (controlled by v s ub) and the amo unt of antiblo o ming protec tion. a low v s ub voltage provi d es the ma ximu m d y na mic r a nge and mini mum (or no) antibloo ming protection. a high vsub voltage provides lower dynamic rang e and maximum antibloo ming protection. the optimal setting of vs u b is written on t h e container in which e a ch kai-2001 is shipped. the given vs ub volt age for each sensor is selected to provide antib l ooming prot ection for bright spot s at least 100 time s saturat ion, whil e maintaining at least 40 ke - of dynamic ran g e. the electronic shutter pr ovides a method of precisely controlling the image exposure time without any mechanical components. if an integration time of t int is desired, then the substr ate voltage of the sensor is pulsed to at least 4 0 vo lts t int seconds before the photodiode t o vccd tran sfer pulse on v2. use of the electronic s hutter does not have t o wait until the previously ac quired image has been completely read out of the v c cd. large signal outp ut when the image sen s or is operated in the binned or summed interlaced mod e s there will be more than 40,000 electrons in the ou tput signal. the image se nsor is de signed with a 16v/ e charge to voltage conver sion on the output. this means a full signal of 40, 000 electrons will produce a 640 mv chang e on the output amp l ifier. the output amplifier was designed to handle a n o u t p u t s w i n g o f 6 4 0 m v a t a p i x e l r a t e o f 4 0 m h z . i f 80,000 electron charge packets are g e nerated in the binned or summed interlaced modes then the out p ut amp l ifier output will h a ve to sw ing 1 280 mv. the out p ut amp l ifier doe s not have enou gh bandwidth (slew rate) to handle 1280 mv at 40 mh z. hence, the pixel rate will have to be re duced to 20 mhz if the full dynamic range of 80,00 0 electr o ns is desired . the charge handling c a pacity of the ou tput ampl ifier is al so set by th e reset clock vo ltage le vels. the reset clock driver circuit is very si mple if an amplitud e of 5 v i s u s ed. but the 5 v amplitude restricts the output amplifier charge capac i ty to 40,000 electrons. if the full dynamic range of 80,000 electrons is desired then the reset cl ock amp l itude will have to be in creased to 7 v. if you only want a maximu m sign al of 4 0 ,000 electro ns in binned or su mmed interlaced modes, then a 40 mhz pixel rate wit h a 5 v reset clock may be used. the output of the amp l ifier will be unpredictable above 40,000 electron s so be su re to se t the maxi mum input s i gnal level of your anal og to digi ta l converter to the equivalent of 40,0 00 elec trons (64 0 mv ). ?east m an kodak compan y, 2 006 www.kodak.com/go/imager s r e vision 2 . 0 mtd/ps-0 60 9 p 3 7
storage and handling storage conditions d e s c r i p t i o n s y m b o l m i n i mum maximum u n i t s n o t e s storage temper atu r e t st - 5 5 8 0 c 1 humi di t y r h 5 9 0 % 2 note s: 1 . lon g -ter m exp o su r e towa r d th e m a ximu m temper a t u r e will acceler a te color f i lter deg r adation . 2. t =25 oc . e x c e ssi ve humi d i t y wi ll de grade mt t f . esd 1. this device contains limited protection again s t electrostatic discharge (esd). ccd image sensor s can be damaged by electrost atic disch a rge. failure to do so may alter device p e rformance and reliability. 2. devices shou ld be handled in accordanc e with strict esd procedures for class 0 (<250v per jesd22 human body model test), o r class a (< 2 00v jesd 22 machine mod e l test) device s. devices are shipped in s t atic-s afe co ntainers and should only b e handled at static- s afe w o rkst ations. 3. see applic ati o n note mt d/ps-0224 ?electrostatic discharge control for image sen s or s? for prope r handling and grounding procedures . this application note als o contains reco mmendation s for workplace modi ficati ons for the m i nimi zation of electrostatic discharge. 4. store devices in containers made of electro- conductive materials . cover gla s s care and cleanliness 1. the cover glass is highly susceptible to particles and other contam ination. p e rform al l as se mbly operation s in a cle a n environment. 2. touching the cover glass must be avoide d 3. improper cle a ning of the cover glass may d a mage these devices. refer to applic ation note mtd/ps- 0237 ?cover glass cle a ning for i m age s e nsors? environmental expo sure 1. do not expose to s t rong sun light for long periods of time. the c o lor filters and/or microlenses may become disc olored. l o n g time expo su res to a st atic high contrast scene should be avoided. the image sensor may become discolored and localized ch an ges in respon se may occur from color filter/microle ns aging. 2. exposure to temperatures exceeding the absolute ma xi mum lev e ls should b e av oided f o r stor age and operation. f a ilure to d o so may alter device performance and reliability. 3. avoid sudden temperature changes. 4. exposure to excessive h u midity will affect device characteristic s and should be avoided. failure to do so may alter device perfor mance and re liability. 5. avoid stor age of the product in the pres ence of dust or corro sive a g en ts or g a se s. long-term st orage sh ould be avoided. deterioration of lead solderability may occu r. it is advi sed that the solder ability of the device leads be re-in s pected after an extended p e riod of storage, over one y e ar. soldering recommendations 1. the soldering iron tip temperature is not to exceed 370oc. f a ilur e to do so may alter device performance and reli ability . 2. flow solderin g method is not recommended. solder dipping can c a use d a mage to the glass and har m the imaging cap a bility of the device. recommended method is by partial heatin g. kod a k recommend s the use of a grou nded 30w soldering iron. heat each p i n for le ss than 2 seconds duration. ?east m an kodak compan y, 2 006 www.kodak.com/go/imager s r e vision 2 . 0 mtd/ps-0 60 9 p 3 8
mechan ic al drawi n gs package note s: 1. see table f o r m a rk i n g cod e 2 . c o ve r gl as s i s ma nu a l l y pl ac ed an d v i s u a l l y al i g ne d ove r die - lo ca t i on ac cur a cy is not g uar an t e ed dim e n s ions unit s : inch [m m ] toleranc e: unless otherw ise specifie d ceram i c +/- 1% no l e ss than 0.005 " l/ f +/- 1% no m o re th an 0 . 00 5" mar k i n g code figure 31: packa g e drawing c o n f i g u r a t i o n m a r k i n g code monochro me kai-20 01 sn monochro me with len s lets kai-20 01 m sn col o r with lenslet s kai-20 01 cm sn ?east m an kodak compan y, 2 006 www.kodak.com/go/imager s r e vision 2 . 0 mtd/ps-0 60 9 p 3 9
die to pa ckage alignment no te s: 1. ce nt er o f i m age is of f s et f r om cent er of package by ( 0 . 0 0 , 0. 00) m m nominal . 2. di e is alig ned w i t h i n + / - 2 degree of any package cavit y edge. d i m e nsions uni ts: in [m m ] to lerances : unless o t herw ise spe cified ce r a m i c + / - 1% n o le ss th an 0. 005" l/ f + / - 1% n o mor e th an 0. 00 5" figu r e 3 2 : die to package align m en t ?east m an kodak compan y, 2 006 www.kodak.com/go/imager s r e vision 2 . 0 mtd/ps-0 60 9 p 4 0
glass epox y : nc o- 150h b th k. 0. 0 02-0. 00 5 4x c 0. 0 2 0 typ [c 0 . 5 1 ] 8 x c 0 . 002 -0 . 008 typ [c 0 . 0 5 - 0 . 2 0 ] n o t es: 1. mate ri als: su bst ra te = sc h o tt d - 263 epoxy = nco- 150hb th k = 0 . 00 2 - 0.005 2. dus t/sc ra tc h cou n t = 10 m i c r on m a x 3. doub le side d a r coa t i n g r e fle c ta nc e: 420 - 435 nm < 2.0% 435 - 630 nm < 0.8% 630 - 680 nm < 2.0% un i t s: in [m m ] tole ra nc e: unl es s othe rw i s e s p e c i f ied + / - 1% no less than 0.005" figur e 33: glass dr awing ?east m an kodak compan y, 2 006 www.kodak.com/go/imager s r e vision 2 . 0 mtd/ps-0 60 9 p 4 1
glass transmission 0 10 20 30 40 50 60 70 80 90 10 0 20 0 300 400 5 0 0 600 7 0 0 8 00 90 0 w a v e l e ngth (nm ) t r an sm issio n ( % ) figur e 34: glass tr ansmission ?east m an kodak compan y, 2 006 www.kodak.com/go/imager s r e vision 2 . 0 mtd/ps-0 60 9 p 4 2
quality assurance and reliability quality strategy: all im age sen s ors will con f orm to t h e specific a tions st ated in t h is docu ment. this will be accomp lished through a combinat ion of st atist i cal process c o ntrol and in sp ection at ke y points of the production pr ocess. typ i cal specification limits are not guaranteed b u t provided as a design target. for further information r e fer to iss application no te mtd/ps-0 292, qualit y and r e liabilit y. replacemen t: all devices are warr anted again s t f a il ure in accord ance with the terms of terms of s a le. this does not include failure due to mechanic al and electrical cause s define d as the liab ility of the cust omer below. liability of the supplier: a reject is defined as an im age sensor that d o es not meet all of the spe c ification s in this document up on receipt by the customer. liability of t he cu st ome r : d a m a ge fr om mech ani c al (scratches or breakage), el ectrostatic discharge (esd) damage, or other electrica l misuse of the device beyond the stated absolute maximum r a tings, which occurred after receipt of the sensor by the customer, shall be the respon sib i lity of th e cu stom er. esd pr ecautions : device s are sh ipp e d in static- s a f e containers and s h ould only be handled at s t atic-s afe workst ation s . see iss ap plication not e mtd/ps-02 24, electros t atic dis c harge control, for handling recommendations . reliability: information con cerning the q u ality ass u rance and reliab ilit y testing p r ocedures and results are av ail a ble fro m the im age sensor solu tions and ca n be supplied upon request. for further information refer to iss applic ation note mtd/ps-02 9 2 , quality and reliab ility. test data re ten t ion: im age sens ors shall h a ve an identifying number traceab l e to a test data file. test d a ta shall be kept for a period of 2 year s after date o f deli very. mechanical: the device assembly dr awing is pr ovide d as a reference. the device will conform to the published package toler a nces. ?east m an kodak compan y, 2 006 www.kodak.com/go/imager s r e vision 2 . 0 mtd/ps-0 60 9 p 4 3
o r der ing inf orm a tion available p a rt configurations par t description par t marking kai-2 0 0 1 -aaa-c r -ba kai-2 0 0 1 -aaa-c r -ae ka i - 20 01 s/n kai-2 0 0 1 -aaa-c f -ba kai-2 0 0 1 -aaa-c f -ae ka i - 20 01 s/n ka i - 20 01 -a b a -c d - b a ka i - 20 01 -a b a -c d - a e ka i - 20 01 m s/n ka i - 20 01 -a b a -c p-b a ka i - 20 01 -a b a -c p-a e ka i - 20 01 m s/n kai - 20 01 -cba-c d -ba kai - 20 01 -cba-c d -ae ka i - 20 01 cm s/n s/n: serial numb e r desig n atio n ka i - in ter l in e ccd k a i-2001-aba-cd-ba co lo r a - m o no chro me c - pi gment, bayer rg b le ns a - no mi cro le ns b - t e l e centri c micro le n s re vi s i on a - c u rr ent re vi sio n gr a d e a - standa rd e - en gineer ing te stin g a - st and a rd b - standa rd wi th de fect map cover glas s d - ar co ated , 2 sid e s, sea l ed f - quart z , se aled p - c l ear, taped on r - ar coa t ed , 2 sid e s, ta ped o n pack age c - cer d i p , si debr a z ed p i ns please contact image sen s or solution s for available part number s . address all inqui r ies and p u rchase orders to: image sen s or solution s eastman kod a k co mp any rochester, n e w york 14 65 0-201 0 phone: (585) 7 22-4 3 8 5 fax: (585) 4 77-4 9 4 7 e-mail: i m ag ers@kodak.com kod a k reser v es the right to change any information contained herein without notice. all infor m ation furnished by kod a k is belie v ed to be acc u rate. warning: life support a ppl ica t ions pol i cy kod a k im age sensor s are not authoriz ed for and sho u ld not be used within life support syst ems without the specific writt e n consent of the eastman kodak comp any. product warr anty is limited to replacement of defe ctive components and does not cover injury or property or other cons equential da mages . ?east m an kodak compan y, 2 006 www.kodak.com/go/imager s r e vision 2 . 0 mtd/ps-0 60 9 p 4 4
revi si on chan ges revisio n number description of changes 1.0 ? i n itial f o r m al r e lease 1.1 ? page 25 ? re mov e d c a uti o n fo r c o ve r glass pr otecti ve tape. th e u s e of th e pr otective tape h a s been discontinued. 2.0 ? updated format ? page 44 ? update d ordering information ?east m an kodak compan y, 2 006 www.kodak.com/go/imager s r e vision 2 . 0 mtd/ps-0 60 9 p 4 5
this p a ge intentionally left blank. ?east m an kodak compan y, 2 006 www.kodak.com/go/imager s r e vision 2 . 0 mtd/ps-0 60 9 p 4 6
this p a ge intentionally left blank. ?east m an kodak compan y, 2 006 www.kodak.com/go/imager s r e vision 2 . 0 mtd/ps-0 60 9 p 4 7
?eastman kodak company, 20 06 . kodak and pixelux are trademarks.

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